30Khz Low Power Ultrasonic Atomization Spray Scattering Nozzles for Semiconductor Photoresist Coating
Description:
Scattering nozzles use low-pressure air/gas to generate uniform and wide spray patterns, with each nozzle reaching a maximum of 9.8 inches (25 centimeters) depending on the distance from the substrate. The speed of the air flow is controllable to allow low or high impact of the atomized spray on the product or substrate. Using multiple nozzles in series can achieve infinite width. Scattering nozzle design is used for wide patterns with high repeatability in slender nozzles.
Parameters:
| Model | FSW-3002-L |
| Name | 30Khz Scattering Ultrasonic Nozzle Atomization |
| Frequency | 30Khz |
| Atomized particle size range(μm) | 15-40 |
| Spray width(mm) | 40-80 |
| Spray flow(ml/min) | 0.5-20 |
| Spray height(mm) | 30-80 |
| Liquid viscosity (cps) | <30 |
| Particle size (μm) | <15 |
| Diversion pressure (Mpa) | <0.05 |
| Application | Suitable for Photoresist coatings on semiconductor chips |
Ultrasonic spraying technology has the following advantages over traditional spraying technology in terms of coating quality:
1. Uniformity and consistency: ultrasonic spraying can produce tiny and even spray particles, so that the coating can be evenly distributed on the target surface, thus achieving the uniformity and consistency of the coating. In contrast, traditional spraying techniques may result in uneven coating thickness or spray marks.
2. Compactness and adhesion: because the spray particles produced by ultrasonic spraying are small and uniform, they can better cover the target surface and form a more dense coating. This improves the adhesion and durability of the coating, reducing the risk of coating detachment or peeling.
3. Control of coating thickness: ultrasonic spraying technology can achieve accurate control of coating thickness by adjusting the size of spray particles and spraying parameters. This precision makes ultrasonic spraying technology suitable for application scenarios that require specific coating thickness, such as thin film coatings or areas with high coating thickness requirements.
4. Reduce solvent evaporation: Ultrasonic spraying is usually carried out at lower pressures, which helps to reduce solvent evaporation in coatings. In contrast, traditional spraying techniques may require higher spraying pressure, leading to faster solvent evaporation and potentially affecting the quality and performance of coatings.
5. Suitable for special coatings: Ultrasonic spraying technology is suitable for various types of coatings, including high viscosity liquids, high solid content liquids, nanoparticle suspensions, etc. This makes ultrasonic spraying technology advantageous in the application of special coatings, allowing for higher quality coatings.
It should be noted that coating quality is not only related to spraying technology, but also influenced by various factors, such as coating quality, surface pretreatment, optimization of spraying parameters, etc. Therefore, when choosing spraying technology, it is necessary to comprehensively consider multiple factors and evaluate and choose according to specific application requirements.
30Khz Low Power Ultrasonic Atomization Spray Scattering Nozzles for Semiconductor Photoresist Coating
Product Tags:
|
|
30Khz Low Power Ultrasonic Atomization Spray Scattering Nozzles For Semiconductor Photoresist Coating Images
|
